Authors

S. Grivet-Talocia, A. Ubolli

Abstract

This paper addresses some issues related to the passivity of interconnect macromodels computed from measured or simulated port responses. The generation of such macromodels is usually performed via suitable least squares fitting algorithms. When the number of ports and the dynamic order of the macromodel is large, the inclusion of passivity constraints in the fitting process is cumbersome and results in excessive computational and storage requirements. Therefore, we consider in this work a post-processing approach for passivity enforcement, aimed at the detection and compensation of passivity violations without compromising the model accuracy. Two complementary issues are addressed. First, we consider the enforcement of asymptotic passivity at high frequencies based on the perturbation of the direct coupling term in the transfer matrix. We show how potential problems may arise when off-band poles are present in the model. Second, the enforcement of uniform passivity throughout the entire frequency axis is performed via an iterative perturbation scheme on the purely imaginary eigenvalues of associated Hamiltonian matrices. A special formulation of this spectral perturbation using possibly large but sparse matrices allows the passivity compensation to be performed at a cost which scales only linearly with the order of the system. This formulation involves a restarted Arnoldi iteration combined with a complex frequency hopping algorithm for the selective computation of the imaginary eigenvalues to be perturbed. Some examples of interconnect models are used to illustrate the performance of the proposed techniques.

Citation

  • Journal: IEEE Transactions on Advanced Packaging
  • Year: 2006
  • Volume: 29
  • Issue: 1
  • Pages: 39–54
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • DOI: 10.1109/tadvp.2005.862659

BibTeX

@article{Grivet_Talocia_2006,
  title={{On the Generation of Large Passive Macromodels for Complex Interconnect Structures}},
  volume={29},
  ISSN={1521-3323},
  DOI={10.1109/tadvp.2005.862659},
  number={1},
  journal={IEEE Transactions on Advanced Packaging},
  publisher={Institute of Electrical and Electronics Engineers (IEEE)},
  author={Grivet-Talocia, S. and Ubolli, A.},
  year={2006},
  pages={39--54}
}

Download the bib file

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